Significantly saving valuable PCB space helps solve one of the major issues of higher density electronics design.  From the first GDT technology innovation in decades, Bourns white paper outlines how its new FLAT® GDTs maintain robust isolation and current-handling overvoltage protection capabilities.  It will present the space-saving benefits designers can leverage for their smaller applications through Bourns’ breakthrough flat package and horizontal circuitry design that significantly reduces the GDTs height and volume.